| 摘要 |
PURPOSE: To enable a wire bonding device to carry out a bonding operation without decreasing in accuracy even if a bonding arm shrinks or expands due to a temperature change. CONSTITUTION: A thermocouple 24 is mounted on a bonding arm 9 to detect its temperature, and an X-Y table 5 is so corrected on position corresponding to the detected temperature of the bonding arm 9 as to make a capillary 10 attached to the tip of the bonding arm 9 located at a position optimal for wire bounding. |
