发明名称 METHOD FOR MOUNTING AN ELECTRONIC COMPONENT ON A SUBSTRANTE
摘要 The aim of the present invention is to provide a method for making a transponder in the form of a card or tag that can be bent or twisted without breaking the electronic component connections. This aim is achieved by means of a method for mounting at least one electronic component (1) comprising substantially planar conductive pads (3) connected to conductive paths on the surface of a generally planar insulating carrier or substrate (5), characterised in that it comprises the following steps: placing the substrate (5) on a working surface with the side comprising the conductive paths (6') facing upwards, placing the electronic component (1) in a recess (7) in the substrate (5) in an area thereof that comprises the conductive paths (6'), such that the conductive pads (3) of the component (1) contact corresponding paths on the substrate (5), and depositing a layer of insulating material (8) both onto the component (1) and at least onto an area of the substrate (5) that is located around said component (1), whereby the conductive pads (3) are electrically connected to the conductive paths (6') by the pressure exerted by said insulating layer (8) on the component.
申请公布号 KR20060017779(A) 申请公布日期 2006.02.27
申请号 KR20057021437 申请日期 2004.05.12
申请人 NAGRAID S.A. 发明人 DROZ FRANCOIS
分类号 H05K13/00;B23K1/00;G06K19/077;H05K1/18;H05K3/28;H05K3/32;H05K13/04 主分类号 H05K13/00
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