| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor device that is easy to be manufactured, extremely thin and high in reliability. <P>SOLUTION: This semiconductor uses a lead frame equipped with a lead frame body 1 composed of a metal plate type member, a groove for forming a lead that has been formed with a desired depth in a lead formation region on the surface of the lead frame body 1, and a lead part has been formed to project above the surface of the lead frame body 1 from inside the groove formed of a material different from that of the lead frame body 1. After the chip is mounted, the lead frame body 1 is removed by etching, and the thin semiconductor device is provided. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
