发明名称 METHOD AND APPARATUS FOR PROCESSING FRAGILE MATERIAL
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a fragile material processing method capable of efficiently developing the crack of a fragile material caused by the irradiation with a laser beam, and a fragile material processing apparatus therefor. <P>SOLUTION: In the method for processing the fragile material W by irradiating the fragile material W with the laser beam emitted from a laser beam source and relatively moving the irradiation position of the laser beam on the surface of the fragile material W along a processing scheduled line C, a cooling liquid film (t) is formed on the whole surface of the fragile material W to cool the fragile material W and, in a state that air (a) is blown against the surface of the fragile material W to bore a hole (h), the irradiation position of the laser beam L and the blowing position of the air (a) are moved along the processing scheduled line C while irradiating the fragile material W exposed from the hole (h) with the laser beam L. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p>
申请公布号 JP2005231035(A) 申请公布日期 2005.09.02
申请号 JP20010252461 申请日期 2001.08.23
申请人 MITSUBOSHI DIAMOND INDUSTRIAL CO LTD 发明人 OTSU YASUHIDE
分类号 B23K26/00;B23K26/12;B23K26/14;B23K26/40;B28D1/22;B28D5/00;C03B33/09;(IPC1-7):B28D5/00 主分类号 B23K26/00
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