发明名称 Process chamber assembly and apparatus for processing a substrate
摘要 In a process chamber assembly and a processing apparatus for processing a substrate using, a process chamber assembly may include a process chamber including a body having a first contact face and a cover for covering the body having a second contact face, the second contact face of the cover seals the body at the first contact face thereof forming a buffer space therebetween, and at least one combining unit in fluid communication with the buffer space and configured to provide vacuum therein.
申请公布号 US2006286801(A1) 申请公布日期 2006.12.21
申请号 US20060448727 申请日期 2006.06.08
申请人 SAMSUNG ELECTRONICS CO., LTD. 发明人 KIM HO-GON
分类号 H01L21/44;C23C16/00 主分类号 H01L21/44
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