| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a cleaving device and a cleaving method by which a substrate to be worked can easily and speedily be cleaved. <P>SOLUTION: The cleaving device 10 is provided with a substrate holder 51 for holding the substrate 60 to be worked, a heating part 30 moving to the substrate 60 which is held by the substrate holder 51 and for irradiating a cleaving intended line 71 on an upper substrate 61 of the substrate 60 with laser beam to locally heat, a cooling part 40 moving to the substrate 60 which is held by the substrate holder 51 and for locally cooling the cleaving intended line 71 on the upper substrate 61 which is locally heated by the heating part 30 and a sheath heater (heating mechanism) 2a arranged in a lower substrate 62 side along a laminated member of the substrate 60. In the cleaving device 10, the lower substrate 62 is kept at a temperature higher than that of the upper substrate 61 near the cleaving extended line 71 in the substrate 60 to produce stress due to the temperature difference between the upper substrate 61 and the lower substrate 62 near the cleaving extended line 71 in the upper substrate 61. <P>COPYRIGHT: (C)2007,JPO&INPIT</p> |
