LEAD FRAME BASED, OVER-MOLDED SEMICONDUCTOR PACKAGE WITH INTEGRATED THROUGH HOLE TECHNOLOGY (THT) HEAT SPREADER PIN(S) AND ASSOCIATED METHOD OF MANUFACTURING

摘要

A method and apparatus are provided for manufacturing a lead frame based, over-molded semiconductor package (7) with an exposed pad or power die flag (70) having multiple integrated THT heat spreader pins (71) configured for insertion into one or more vias (77) formed in a printed circuit board (78). The through hole heat spreader pins (71) may be formed as an integral part of the exposed pad (52) or may be solidly connected with the exposed pad (62).