发明名称 |
SOLDER PASTE, SOLDERED PART, AND MANUFACTURING METHOD OF SOLDERED PART |
摘要 |
PROBLEM TO BE SOLVED: To provide a manufacturing method of a soldered part capable of mitigating the thermal stress exerted in the soldered part even when being exposed to the thermal cyclic environment. SOLUTION: In the manufacturing method of the soldered part, a solder paste containing solder metal powder, hydrogen storage alloy powder in which hydrogen is stored in advance, and flux is heated to the temperature at which the solder metal powder is melted and the hydrogen storage alloy discharges hydrogen. Thus, the solder is melted, and hydrogen is discharged from the hydrogen storage alloy, and the hydrogen is retained and diffused in the soldered part. COPYRIGHT: (C)2009,JPO&INPIT
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申请公布号 |
JP2009131871(A) |
申请公布日期 |
2009.06.18 |
申请号 |
JP20070309952 |
申请日期 |
2007.11.30 |
申请人 |
MITSUI MINING & SMELTING CO LTD |
发明人 |
MIYAKE KOICHI;FUJITA MASAKAZU;HASEGAWA ATSUSHI |
分类号 |
B23K1/19;B23K35/22;B23K35/26;B23K35/30;C22C12/00;C22C13/00;C22C19/00;H05K3/34 |
主分类号 |
B23K1/19 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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