Fan-out interconnect structure and method for forming same

摘要

A method embodiment includes forming a sacrificial film layer over a top surface of a die, the die having a contact pad at the top surface. The die is attached to a carrier, and a molding compound is formed over the die and the sacrificial film layer. The molding compound extends along sidewalls of the die. The sacrificial film layer is exposed. The contact pad is exposed by removing at least a portion of the sacrificial film layer. A first polymer layer is formed over the die, and a redistribution layer (RDL) is formed over the die and electrically connects to the contact pad.

主权项

1. A method for integrated circuit packaging comprising:
forming a first polymer layer over a top surface of a die, the die having a contact pad at the top surface, wherein the first polymer layer is patterned to comprise a first opening exposing the contact pad; forming a sacrificial film layer over the first polymer layer, wherein the sacrificial film layer fills the first opening; attaching the die to a carrier; forming a molding compound over the die, the first polymer layer, and the sacrificial film layer, wherein the sacrificial film layer is disposed between the molding compound and the die, and wherein the molding compound extends along sidewalls of the die and covers a top surface of the sacrificial film layer; exposing the first polymer layer, wherein exposing the first polymer layer comprises removing an upper portion of the sacrificial film layer so that top surfaces of the sacrificial film layer is substantially level with a top surface of the first polymer layer; exposing the contact pad by removing remaining portions of the sacrificial film layer; forming a second polymer layer over the first polymer layer; patterning a second opening through the second polymer layer, wherein the second opening exposes a top surface of the first polymer layer, the first opening, and the contact pad; and forming a redistribution layer (RDL) over the die and electrically connected to the contact pad, wherein the RDL extends through the second opening.