| 摘要 |
PROBLEM TO BE SOLVED: To provide a cutting device capable of maintaining high productivity of device packages.SOLUTION: A cutting device includes: a chuck table (12); cutting means (16); processing feed means for processing-feeding the chuck table; a cassette mounting region (4a) on which a cassette (6) housing a plurality of processed units (11) is mounted; conveying means (42) for conveying the processed units between the cassette mounted on the cassette mounting region and the chuck table; imaging means (36); and control means (44) for controlling the respective components. The cutting device is also configured such that, when position and direction of a dividing scheduled line (21) of a package substrate held on the chuck table are out of a predetermined region, the processed unit is carried out of the chuck table, then, after positions and directions of the chuck table and the processed unit are adjusted so that the position and direction of the dividing scheduled line lie within the predetermined region, the processed unit is carried onto the chuck table again.SELECTED DRAWING: Figure 1 |
