发明名称 LAMINATE AND VACUUM HEAT INSULATION MATERIAL USING THE SAME
摘要 PROBLEM TO BE SOLVED: To provide a laminate capable of efficiently reducing heat bridge, excellent in processability and inhibiting generation of pinhole or crack.SOLUTION: There is provided a laminate having at least one polymer layer, a gas barrier layer and at least one polymer layer in this order arranged via adhesive layers between layers, the gas barrier layer has heat resistance of 650 K/W or more and Young modulus of 100 GPa or more and a position of a neutral axis represented by the following formula is positioned in the gas barrier layer. where y is a distance from an upper face in compression side during blending to the natural axis, Ei is Young modulus of the i-th layer. Si is cross section primary moment of the i-th layer, Ai is cross section area of the i-th layer and n is the number of layers constituting the laminate and the integer of 5 or more.SELECTED DRAWING: Figure 1
申请公布号 JP2016124186(A) 申请公布日期 2016.07.11
申请号 JP20140266580 申请日期 2014.12.26
申请人 SAMSUNG ELECTRONICS CO LTD 发明人 KIMURA MITSUHARU;ODAWARA MAKOTO;NAGAYAMA KENICHI
分类号 B32B15/085;B32B15/08;B65D65/40;F16L59/065 主分类号 B32B15/085
代理机构 代理人
主权项
地址