| 摘要 |
PROBLEM TO BE SOLVED: To provide a semiconductor device that has no flash burr on a die pad rear face.SOLUTION: A semiconductor device comprises: a semiconductor chip; a die pad 3 for fixing the semiconductor chip via an adhesive agent; a plurality of leads 6b; a bonding wire; and an encapsulation resin 8. In the semiconductor device, a plurality of circular arc grooves 10a are continuously formed on a rear face of the die pad 3 for fixing the semiconductor chip by shifting them little by little so as to be partially overlapped with each other to prevent flash burrs 9 from being formed, and the rear face is exposed from the encapsulation resin 8.SELECTED DRAWING: Figure 2 |
