| 主权项 |
1. A liquid cooling heat dissipation structure, comprising:
a heat conduction module including a first heat-conducting substrate contacting at least one heat-generating source, a second heat-conducting substrate disposed on the first heat-conducting substrate, and a plurality of heat-conducting support members connected between the first heat-conducting substrate and the second heat-conducting substrate, wherein the first heat-conducting substrate has a plurality of first capillary structures, the second heat-conducting substrate has a plurality of second capillary structures, an enclosed receiving space filled with working fluid is formed between the first heat-conducting substrate and the second heat-conducting substrate, and all of the first capillary structures, the second capillary structures, and the heat-conducting support members are received in the enclosed receiving space; a heat dissipation module disposed on the heat conduction module; and a liquid supply module detachably disposed on the heat conduction module to cover the heat dissipation module, wherein the liquid supply module includes an external cover body covering the heat dissipation module, a radial-flow centrifugal impeller detachably disposed on the external cover body, and a fluid-splitting board disposed inside the external cover body and disposed above the heat dissipation module, and the radial-flow centrifugal impeller has at least one liquid inlet and at least one liquid outlet; wherein the heat conductivity coefficient and the temperature uniformity of the heat conduction module is larger than the heat conductivity coefficient and the temperature uniformity of the heat dissipation module, and the heat-dissipating area of the heat dissipation module is larger than the heat-dissipating area of the heat conduction module. |
