| 摘要 |
A liquid cooling heat dissipation structure includes a single heat conduction module and an assembly liquid supply module. The single heat conduction module includes a heat-conducting substrate contacting a heat generation source, a plurality of heat-conducting fins fixedly disposed on the heat-conducting substrate, a heat-conducting fluid-splitting board fixedly disposed on the heat-conducting substrate, and a heat-conducting fluid-conducting board fixedly disposed on the heat-conducting fluid-splitting board. The assembly liquid supply module includes an external cover body detachably disposed on the heat-conducting substrate and a rotary component detachably disposed between the external cover body and the heat-conducting fluid-conducting board. Therefore, cooling liquid passes through at least one liquid inlet and flows into the external cover body to contact the single heat conduction module by driving the rotary component, so that heat transmitted from the heat generation source to the single heat conduction module is absorbed by the cooling liquid. |
| 主权项 |
1. A liquid cooling heat dissipation structure, comprising:
a single heat conduction module including a heat-conducting substrate contacting a heat generation source, a plurality of heat-conducting fins fixedly disposed on the heat-conducting substrate, a heat-conducting fluid-splitting board fixedly disposed on the heat-conducting substrate to cover the heat-conducting fins, and a heat-conducting fluid-conducting board fixedly disposed on the heat-conducting fluid-splitting board, wherein the heat-conducting fluid-splitting board has a first fluid-conducting opening and a second fluid-conducting opening communicated with the first fluid-conducting opening through a first receiving space, and the heat-conducting fluid-splitting board has a first fluid-splitting opening communicated with the second fluid-conducting opening through a second receiving space and a second fluid-splitting opening communicated with the first fluid-splitting opening through a third receiving space; and an assembly liquid supply module including an external cover body detachably disposed on the heat-conducting substrate and a pump detachably disposed on the external cover body, wherein the heat-conducting fins, the heat-conducting fluid-splitting board, and the heat-conducting fluid-conducting board are received inside the external cover body, and the external cover body has at least one liquid inlet communicated with the first liquid-conducting opening through a fourth receiving space and at least one liquid outlet communicated with the second fluid-splitting opening; wherein heat generated by the heat generation source is transmitted to the heat-conducting substrate, the heat-conducting fins, the heat-conducting fluid-splitting board, and the heat-conducting fluid-conducting board of the single heat conduction module; wherein cooling liquid passes through the at least one liquid inlet and flows into the external cover body to contact the heat-conducting substrate, the heat-conducting fins, the heat-conducting fluid-splitting board, and the heat-conducting fluid-conducting board by driving the pump, so that the heat that has been transmitted to the heat-conducting substrate, the heat-conducting fins, the heat-conducting fluid-splitting board, and the heat-conducting fluid-conducting board of the single heat conduction module is absorbed by the cooling liquid. |
