| 摘要 |
PROBLEM TO BE SOLVED: To provide a technology for inhibiting adhesive force between an IC chip and a substrate from deteriorating even if temperature and humidity increase.SOLUTION: An information recording medium 1 includes an IC module 4, a core sheet 2, and an adhesive sheet 8. The IC module 4 mounts an IC chip 4c on a substrate 4b. The core sheet 2 includes the IC module and is formed in the shape of a sheet. A burying hole 6 is formed in the core sheet 2. The burying hole 6 is punched with a step in the thickness direction of the core sheet, and the IC module 4 is buried. The adhesive sheet 8 adheres the substrate 4b and the step 6a while the substrate 4b of the IC module 4 is mounted on the step 6a of the burying hole 6. The core sheet 2 is made of resin without containing filler material. |
