发明名称 半導体装置
摘要 PROBLEM TO BE SOLVED: To provide a trench-gate semiconductor device in which a feedback capacitance is reduced and the complexity of the manufacturing processes of a gate insulating film is suppressed.SOLUTION: A semiconductor device comprises: a first-conductivity-type first semiconductor region; a second-conductivity-type second semiconductor region disposed on the first semiconductor region; a first-conductivity-type third semiconductor region disposed on the second semiconductor region; an insulation film disposed on a bottom surface and a side surface of a groove that extends from the upper surface of the third semiconductor region to the first semiconductor region through the third semiconductor region and the second semiconductor region; and a control electrode disposed in a band shape along a region facing at least the second semiconductor region in the residual region of the region facing the first semiconductor region, on the insulation film on the side surface of the groove.
申请公布号 JP6020488(B2) 申请公布日期 2016.11.02
申请号 JP20140036157 申请日期 2014.02.27
申请人 サンケン電気株式会社 发明人 川尻 智司
分类号 H01L29/78;H01L21/336;H01L29/41;H01L29/423;H01L29/49;H01L29/739 主分类号 H01L29/78
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