| 摘要 |
PROBLEM TO BE SOLVED: To facilitate manufacture of a semiconductor device.SOLUTION: A manufacturing device for a semiconductor device of this embodiment comprises: a stage for holding a second surface of a semiconductor wafer and a deposited tape, the semiconductor wafer including a first surface and the second surface at an opposite side of the first surface; a vacuum mechanism which is adsorbed at an upper side of a substrate that is provided while being deposited on the first surface; a drive part which drives the vacuum mechanism in a direction away from the substrate; and a cooling part capable of cooling the tape. A manufacturing method of a semiconductor device of this embodiment includes: a step for bonding a substrate to a first surface of a semiconductor wafer including the first surface and a second surface that is opposite to the first surface; a step for forming a contact including a convex portion on the second surface, through the semiconductor wafer; a step for depositing a tape to the second surface; and a peeling step for peeling the substrate by increasing an elastic modulus of the tape and making longer a distance between the semiconductor wafer and the substrate.SELECTED DRAWING: Figure 13 |
