ALLOY TARGET FOR SPUTTERING, AND PRODUCTION METHOD OF ALLOY TARGET FOR SPUTTERING

摘要

PROBLEM TO BE SOLVED: To provide an alloy target for sputtering capable of having an optical characteristic for applying as a blackened layer of a conductive substrate, and having an etching property capable of etching simultaneously with a wiring layer.SOLUTION: In an alloy target for sputtering produced by a dissolution method, and comprising a dissolved alloy containing copper, nickel and tungsten, a composition of the dissolved alloy has tungsten as much as 2 atom% or more and 16 atom% or less, nickel as much as 20 atom% or more and 90 atom% or less, and a residue constituted of copper.SELECTED DRAWING: Figure 1