| 摘要 |
The compositions comprise a resin which can be processed at temperatures up to 160 DEG C and contain an incorporated, flame-inhibiting amount of a salt formed by reacting dimethyl methylphosphonate, monomethyl methylphosphonate or methylphosphonic acid with a compound of the formula (I) …<IMAGE>… in which X is O or S, R<1> is H, alkyl having 1 to 4 carbon atoms, alkenyl having up to 4 carbon atoms, CN, CONH2 or NH2, R<2> is H, alkyl having 1 to 4 carbon atoms or alkenyl having up to 4 carbon atoms, or R<1> and R<2>, together with the carbon atom to which they are bonded, form a heterocyclic ring having up to 6 carbon atoms and optionally a further hetero atom, and R is H, an alkyl group having 1 to 8 carbon atoms, an aryl group having 6 to 10 carbon atoms, a cycloalkyl group having 5 to 12 carbon atoms or a heterocyclic group having up to 9 ring carbon atoms, or together with R<1> forms an alkylene chain having 3 to 10 carbon atoms or is an NHR<3> group in which R<3> is H, alkyl having 1 to 4 carbon atoms, alkenyl having up to 4 carbon atoms, CN, CONH2 or NH2, or, together with R<1>, forms an alkylene chain having 2 or 3 carbon atoms, or R is a …<IMAGE>… group in which R<1> and R<2> are as defined above, and R<4> is a direct bond, an alkylene group having up to 8 carbon atoms or an arylene group having 6 to 10 carbon atoms. |
