发明名称 REMOVING METHOD OF RESIST AND CURING PRESSURE-SENSITIVE ADHESIVE SHEET AND THE LIKE
摘要 PURPOSE:To remove a resist on an unnecessary article easily and surely in a manufacture of a semiconductor or a circuit. CONSTITUTION:A curing pressure-sensitive adhesive sheet or other similar materials are stuck on an article on which a resist pattern exists. After a recess of the resist pattern is partially penetrated with the adhesive by pressurizing and/or heating, a curing is performed and then the adhesive sheet or other similar materials and the resist material are peeled integrally.
申请公布号 JPH0637010(A) 申请公布日期 1994.02.10
申请号 JP19920212176 申请日期 1992.07.15
申请人 NITTO DENKO CORP;HITACHI LTD 发明人 MOROISHI YUTAKA;SHIMODAN HIDEAKI;ICHIKAWA HIROKI;AIZAWA KAORU;MORIUCHI NOBORU
分类号 C09J5/00;C09J7/02;G03F7/42;H01L21/027;H01L21/30;H05K3/06;(IPC1-7):H01L21/027 主分类号 C09J5/00
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