发明名称 |
REMOVING METHOD OF RESIST AND CURING PRESSURE-SENSITIVE ADHESIVE SHEET AND THE LIKE |
摘要 |
PURPOSE:To remove a resist on an unnecessary article easily and surely in a manufacture of a semiconductor or a circuit. CONSTITUTION:A curing pressure-sensitive adhesive sheet or other similar materials are stuck on an article on which a resist pattern exists. After a recess of the resist pattern is partially penetrated with the adhesive by pressurizing and/or heating, a curing is performed and then the adhesive sheet or other similar materials and the resist material are peeled integrally. |
申请公布号 |
JPH0637010(A) |
申请公布日期 |
1994.02.10 |
申请号 |
JP19920212176 |
申请日期 |
1992.07.15 |
申请人 |
NITTO DENKO CORP;HITACHI LTD |
发明人 |
MOROISHI YUTAKA;SHIMODAN HIDEAKI;ICHIKAWA HIROKI;AIZAWA KAORU;MORIUCHI NOBORU |
分类号 |
C09J5/00;C09J7/02;G03F7/42;H01L21/027;H01L21/30;H05K3/06;(IPC1-7):H01L21/027 |
主分类号 |
C09J5/00 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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