| 摘要 |
PURPOSE:To provide a wire bonding device which connects a semiconductor device with a circuit substrate, with ease and reliability, and a method for forming a bump, while the bump of desired height and shape is obtained with no extra levelling process, accompanied by shorter bump-formation time and less casts, relating to the process for forming a bump of a semiconductor device. CONSTITUTION:Relating to a capillary 1 for ball-bonding for forming a bump 7 on an electrode pad 13 of a semiconductor device 6, a pressurizing member that pressurizes a ball-like tip of a metal wire 4 to an electrode pad 13 so that the tip is press-fixed to the pad 13, a draw-out hole 2 that, provided at the pressurizing member, supplies with the metal wire 4, and a levelling member 31 far uniforming the heights of bumps 7 formed on the electrode pad 13, are provided. |
