| 摘要 |
PROBLEM TO BE SOLVED: To reduce quality deterioration by curing and developing a thin and a thick resist portion while exposing them through an exposing mask arranged above them, and then by subjecting the cured portions to a curing process, thereby obtaining resist-formed conductor pattern regions and hence forming solder resists on a thin and a thick portion of the resist-formed conductor pattern regions. SOLUTION: A thin resin layer 37 is formed on both regions A and B by printing a photo-curing resin for forming solder resists. The region A has a conductor pattern 33 for wire bonding, and the region B a conductor pattern 34 for ball pads. A thickening resin layer 38 is formed on the layer 37 that extends over the region B, thereby forming a thick resin layer 39. Successively, the layers 37 and 39 are exposed collectively at the same time using an exposing mask 40, thereby forming resin-cured portions 41. The layers 37 and 39 having the portions 41 are developed and cured, thereby forming a thin solder resist 35 and a thick solder resist 36.
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