发明名称 |
METHOD FOR TREATING AND MODIFYING A TWO-STEP HYBRID SURFACE FOR IMPROVING AN OHMIC CONTACT OF A PHOTOELECTRIC/ELECTRONIC DEVICE |
摘要 |
PURPOSE: A method for treating and modifying a two-step hybrid surface for improving an ohmic contact of a photoelectric/electronic device is to provide greatly improved specific contact resistance, by performing a treatment and a modification in a chemical solution or gas plasma before forming a metal thin film. CONSTITUTION: A surface of a mesa-etching semiconductor substrate is firstly processed in an acid or alkaline chemical solution and/or gas plasma. Right before an ohmic electrode metal is evaporated on the processed substrate, the surface of the firstly processed substrate is secondly processed in an acid or alkaline chemical solution and/or gas plasma.
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申请公布号 |
KR20000073673(A) |
申请公布日期 |
2000.12.05 |
申请号 |
KR19990017111 |
申请日期 |
1999.05.13 |
申请人 |
KWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY |
发明人 |
PARK, SEONG JU;SUNG, TAE YEON;JANG, JA SUN |
分类号 |
H01L21/30;(IPC1-7):H01L21/30 |
主分类号 |
H01L21/30 |
代理机构 |
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代理人 |
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地址 |
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