发明名称 METHOD FOR TREATING AND MODIFYING A TWO-STEP HYBRID SURFACE FOR IMPROVING AN OHMIC CONTACT OF A PHOTOELECTRIC/ELECTRONIC DEVICE
摘要 PURPOSE: A method for treating and modifying a two-step hybrid surface for improving an ohmic contact of a photoelectric/electronic device is to provide greatly improved specific contact resistance, by performing a treatment and a modification in a chemical solution or gas plasma before forming a metal thin film. CONSTITUTION: A surface of a mesa-etching semiconductor substrate is firstly processed in an acid or alkaline chemical solution and/or gas plasma. Right before an ohmic electrode metal is evaporated on the processed substrate, the surface of the firstly processed substrate is secondly processed in an acid or alkaline chemical solution and/or gas plasma.
申请公布号 KR20000073673(A) 申请公布日期 2000.12.05
申请号 KR19990017111 申请日期 1999.05.13
申请人 KWANGJU INSTITUTE OF SCIENCE AND TECHNOLOGY 发明人 PARK, SEONG JU;SUNG, TAE YEON;JANG, JA SUN
分类号 H01L21/30;(IPC1-7):H01L21/30 主分类号 H01L21/30
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