| 摘要 |
PROBLEM TO BE SOLVED: To provide an electronic component in which high frequency components can be attenuated more efficiently. SOLUTION: Ceramic films 22-3, 22-4 are formed using second dielectric paste on a ceramic sheet 31 (permittivityε1) formed by applying first dielectric paste on a PET film 30. A pattern of signal line 22-2 is then printed with conductive paste on the central part of the ceramic sheet 31 such that the right half 22-3a in the longitudinal direction of the ceramic film 22-3 and the left half 22-4a in the longitudinal direction of the ceramic film 22-4 are covered. Subsequently, ceramic films 22-5, 22-6 are formed such that the side end parts 22-2d, 22-2e of the signal line 22-2 are clamped between the ceramic films 22-3, 22-4.
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