| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a water disperse form for a chemical mechanical polishing capable of decreasing polishing damages without reducing any polishing speed, and to provide a chemical mechanical polishing method using the water disperse form for the polishing, capable of removing excess insulating films in a refined element isolation process. <P>SOLUTION: The water disperse form for the chemical mechanical polishing contains abrasive grains A including ceria, an anion nature soluble polymer B, and a cation nature surfactant C. It is characterized in that a content of the anion nature soluble polymer B is 60 to 600 parts by weight per the abrasive grains A of 100 parts by weight including the ceria, and a content of the cation nature surfactant C is 0.1 to 100ppm to the whole water disperse form for the chemical mechanical polishing. <P>COPYRIGHT: (C)2005,JPO&NCIPI</p> |
