| 摘要 |
There is provided a multilayer printed wiring board including semiconductor element therewithin, which can realize high density wiring. A multilayer printed wiring board 1 includes a first printed wiring board 10 having a semiconductor element 2 mounted on a wiring pattern 12, a second printed wiring board 21 laminated on the wiring pattern 12 through a first insulating layer 20, a third printed wiring board 31 laminated on the second printed wiring board 21 through a second insulating layer 30, and a space region penetrating through the first insulating layer 20 and the second printed wiring board 21 in the thickness direction and adapted so that the semiconductor element 2 can be accommodated therewithin. The second printed wiring board 21 includes first bumps 26 penetrating through the first insulating layer 20 in the thickness direction, and second bumps 28 penetrating through the insulating layer 27 in the thickness direction, and the bumps 26 and 28 each have a diameter of the maximum bottom surface ranging from 50 mum to 200 mum.
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