| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a surface-mountable semiconductor device having a low cost leadless structure that can be thinned, and being excellent in strength. <P>SOLUTION: The semiconductor device 10 has a leadless structure composed of an semiconductor element 10, wires 30, and a plurality of conducting parts 20 sealed with a sealing resin 40 in a state in which electrodes 11 at upper side of the semiconductor device 10 and the upper sides of the conducting parts 20 are electrically connected by the wires 30, respectively, and the lower side of the semiconductor device 10 on which no electrode is formed and the lower sides of the conducting parts 20 not connected to the wires 30 are exposed to the rear surface, wherein each of the conducting part 20 has an overhang portion 20a composed of noble metal plated layer at least the upper side thereof. Since, the overhang portions 20a of the conducting parts 20 exhibit a firm anchoring effect in the sealing resin 40, the semiconductor device 10 has high bonding strength between each of the conducting parts 20 being connection portions to the outside and the sealing resin 40, resulting in a semiconductor device that is excellent in strength. <P>COPYRIGHT: (C)2009,JPO&INPIT |
