| 摘要 |
The present invention relates to a photo-curable resin composition using a photo fabrication method, wherein the photo-curable resin composition comprises: 60 to 95 wt% of a photo fabrication resin; 2 to 20 wt% of wax having a melting point of 30 to 90°C; and a residual additive. In addition, the photo-curable resin composition improves the deformation during fabrication or after finishing the fabrication, when performing the photo fabrication. |
