发明名称 FLEXIBLE COPPER-CLAD PLATE HAVING HIGH PEEL STRENGTH AND MANUFACTURE METHOD THEREOF
摘要 A flexible copper-clad plate having a high peel strength and a manufacture method thereof, the copper-clad plate comprises the following layer structures: an organic polymer film layer (1), an adjusting layer (2), a transition layer (3) and a copper layer (4); the manufacture method thereof comprises the following steps of: 1) forming the adjusting layer on at least one surface of the organic polymer film layer; 2) forming the transition layer; and 3) forming the copper layer; or, 1) modifying the surface of the organic polymer film layer, and then forming the adjusting layer on at least one surface of the film layer; 2) forming the transition layer; and 3) forming the copper layer; or, 1) forming the adjusting layer on at least one surface of the organic polymer film layer; 2) modifying the surface; 3) forming the transition layer; and 4) forming the metal copper layer; or, 1) modifying at least one surface of the organic polymer film layer; 2) forming the adjusting layer; 3) modifying the surface; 4) forming the transition layer; and 5) forming the copper layer. By means of the coating method, the copper-clad plate having a higher peel strength is formed; and the thickness of the copper foil of the copper-clad plate can be very thin.
申请公布号 WO2016086468(A1) 申请公布日期 2016.06.09
申请号 WO2014CN94379 申请日期 2014.12.19
申请人 GUANGZHOU FANG BANG ELECTRONICS CO., LTD. 发明人 SU, ZHI
分类号 B32B15/04;B32B27/08;B32B37/00 主分类号 B32B15/04
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