MANUFACTURING METHOD OF LED CARRIER

摘要

An LED carrier includes a substrate, a metallic layer, an insulating layer, and a reflecting layer. The metallic layer is disposed on the substrate and has a die bonding region and a ring-shaped wiring region separated from the die bonding region. A region arranged between the die bonding region and the ring-shaped wiring region is defined as an insulating region. The insulating layer at least partially covers the insulating region. The reflecting layer is arranged above the die bonding region and at least partially covers the top surface of the insulating layer. Moreover, the instant disclosure also provides a manufacturing method of an LED carrier.

主权项

1. A manufacturing method of an LED carrier, comprising:
providing a substrate; forming a metallic layer having a first pattern on the substrate; and forming an insulating layer having a second pattern on the substrate, wherein the second pattern is complementary to the first pattern.