| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a method of jointing between terminals for obtaining excellent electrical connection between the terminals of confronting electrodes or the like, and a packaging method of a semiconductor device using the method of jointing. <P>SOLUTION: An electrode pad 21 of a semiconductor chip 20 and a land 11 on a wafer 10 which is provided to correspond to the electrode pad 21, are disposed to face each other via conductive adhesives. Afterwards, the conductive adhesives are heated to a temperature which is higher than the melting point of conductive particles contained in the conductive adhesives and in which curing of resins is not completed, and conductive particles are mutually coupled. Further, resins in the conductive adhesives are completely cured, thereby fixing the semiconductor chip 20 and the wafer 10. <P>COPYRIGHT: (C)2004,JPO&NCIPI |
