| 发明名称 | Photocurable and thermosetting resin composition, dry film solder resist manufactured therefrom, and circuit board including the solder resist | ||
| 摘要 | The present invention relates to a photocurable and thermosetting resin composition, including an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds of spherical alumina particles having different particle diameters from each other, and an organic solvent, a dry film solder resist obtained from the resin composition, and a circuit board including the dry film solder resist. | ||
| 申请公布号 | US9416243(B2) | 申请公布日期 | 2016.08.16 |
| 申请号 | US201414411843 | 申请日期 | 2014.06.17 |
| 申请人 | LG CHEM, LTD. | 发明人 | Choi Byung Ju;Jeong Woo Jae;Choi Bo Yun;Lee Kwang Joo;Jeong Min Su;Ku Se Jin |
| 分类号 | G03F7/027;C08K3/04;C08K3/08;C09D133/06 | 主分类号 | G03F7/027 |
| 代理机构 | Rothwell, Figg, Ernst & Manbeck, P.C. | 代理人 | Rothwell, Figg, Ernst & Manbeck, P.C. |
| 主权项 | 1. A photocurable and thermosetting resin composition, comprising an acid modified oligomer, a photopolymerizable monomer, a thermosetting binder resin, a photoinitiator, two or more kinds of spherical alumina particles having different particle diameters from each other, a carbon compound having a surface coated with a thermal conductive ceramic compound, and an organic solvent, wherein the carbon compound having a surface coated with the thermal conductive ceramic compound contains 0.5% to 20% by weight of the thermal conductive ceramic compound, and 80% to 99.5% by weight of the carbon compound. | ||
| 地址 | Seoul KR | ||