发明名称 |
PUNCHED ADHESIVE TAPE FOR SEMICONDUCTOR, METHOD OF MANUFACTURING LEAD FRAME WITH THE ADHESIVE TAPE, LEAD FRAME WITH THE ADHESIVE TAPE, AND SEMICONDUCTOR DEVICE COMPRISING THE LEAD FRAME. |
摘要 |
<p>A PUNCHED ADHESIVE TAPE (1) FOR SEMICONDUCTOR WHICH IS MADE BY PUNCHING AN ADHESIVE TAPE COMPRISING A BASE FILM (2) AND AN ADHESIVE LAYER (3) PROVIDED ON ONE OR EACH SIDE OF THE BASE FILM (2) TO MARK THE REGIONS IN THE ADHESIVE TAPE WHERE CONTAMINANTS OR DEFECTS ARE CONTAINED; A METHOD OF PRODUCING AN ADHESIVE TAPE-BEARING LEAD FRAME BY PUNCHING THE PUNCHED ADHESIVE TAPE (1) FOR SEMICONDUCTOR, WITH THE PARTS CONTAINING THE PUNCHED HOLES (4) SKIPPED OVER, AND APPLYING THE ADHESIVE TAPE PIECES PUNCHED OUT FROM THE PUNCHED ADHESIVE TAPE (1) FOR SEMICONDUCTOR TO A LEAD FRAME; A SEMICONDUCTOR DEVICE FABRICATED BY USING THE ADHESIVE-BEARING LEAD FRAME.</p> |
申请公布号 |
MY122247(A) |
申请公布日期 |
2006.04.29 |
申请号 |
MY1998PI03221 |
申请日期 |
1998.07.14 |
申请人 |
HITACHI CHEMICAL COMPANY, LTD. |
发明人 |
YOSHIYUKI TANABE;YOSHIHIRO NOMURA;HIROSHI KIRIHARA;YOUICHI HOSOKAWA;SHINJI IIOKA;SATORU YANAGISAWA |
分类号 |
B26D5/38;H01L23/495;H01L23/544 |
主分类号 |
B26D5/38 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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