发明名称 ACOUSTIC WAVE DEVICE
摘要 An acoustic wave device includes: a support substrate; a piezoelectric substrate bonded to the support substrate; a first acoustic wave element formed on the piezoelectric substrate; a frame formed on the support substrate to surround the first acoustic wave element; and a substrate formed on the frame so that a cavity to which the first acoustic wave element is exposed is formed above the piezoelectric substrate, wherein a difference in linear expansion coefficient between the support substrate and the substrate in a first direction in a surface direction of the piezoelectric substrate is less than a difference in linear expansion coefficient between the support substrate and the piezoelectric substrate in the first direction, and the piezoelectric substrate remains in a region where the first acoustic wave element is formed and is removed in a region where the frame is formed.
申请公布号 US2016248398(A1) 申请公布日期 2016.08.25
申请号 US201514949535 申请日期 2015.11.23
申请人 TAIYO YUDEN CO., LTD. 发明人 KUROYANAGI Takuma
分类号 H03H9/02 主分类号 H03H9/02
代理机构 代理人
主权项 1. An acoustic wave device comprising: a support substrate; a piezoelectric substrate bonded to the support substrate; a first acoustic wave element formed on the piezoelectric substrate; a frame formed on the support substrate to surround the first acoustic wave element; and a substrate formed on the frame so that a cavity to which the first acoustic wave element is exposed is formed above the piezoelectric substrate, wherein a difference in linear expansion coefficient between the support substrate and the substrate in a first direction in a surface direction of the piezoelectric substrate is less than a difference in linear expansion coefficient between the support substrate and the piezoelectric substrate in the first direction, and the piezoelectric substrate remains in a region where the first acoustic wave element is formed and is removed in a region where the frame is formed.
地址 Tokyo JP