SUBSTRATE PROCESSING DEVICE

摘要

PROBLEM TO BE SOLVED: To provide a substrate processing device capable of securely breaking and removing an end material even when processing a thin-plate substrate having a narrow terminal region.SOLUTION: A substrate processing device comprises: a turntable 19 on which a substrate W3 having a scribe line S3 for terminal which demarcates a terminal region T and alignment marks M formed is placed; a read mechanism 20 which reads the alignment marks M; a control part 21 which rotates the turntable 19 based upon a quantity of deviation of the substrate W3 having been read by the read mechanism 20 from a reference position and puts the substrate W3 back to the reference position; and a conveying mechanism 23 which picks up the substrate W3 having been put back to the reference position and conveys the substrate to a breaking mechanism 22 comprising a break bar 32 for breaking the scribe line S3 for terminal.SELECTED DRAWING: Figure 1