Alignment support device and alignment support method for probe device

摘要

The present invention provides a probe device that includes an alignment utility function. When a user inputs a condition value for a variation amount (variation range) of a contact position at which a probe is in contact with each chip, in a simulation using actual measurement data acquired by measuring a position of each of all chips in one wafer, a range of variation of each chip is calculated by changing a measurement point at which alignment is performed to calculate a setting of optimum measurement points so that the range of variation is equal to or less than the condition value and the number of measurement points is minimum. Then information on the optimum measurement point is provided to the user.

主权项

1. An alignment support device for a probe device which brings probes of a tester into contact with a plurality of chips formed on a wafer, the alignment support device comprising:
an actual measurement data acquisition unit configured to acquire actual measurement data showing an actual measurement position of all the chips of the wafer; a condition value input unit configured to input a condition value related to a variation amount of a position at which each probe is in contact with each of the chips when the chips are brought into contact with the probes; a measurement point setting unit configured to set chips to which alignment is to be performed from among all the chips of the wafer, as measurement points; a shot position setting unit configured to set, as a shot position, positions of the probes with respect to the wafer when each of the chips of the wafer is brought into contact with the probe at an ideal contact position, and corrects the set shot position based on the actual measurement position of chips to be the measurement points set by the measurement point setting unit; a variation amount calculation unit configured to calculate the variation amount of a position of each of the chips of the wafer based on the actual measurement position of each of the chips when it is assumed that each of the chips of the wafer is brought into contact with the probe in accordance with the shot position after correction set by the shot position setting unit; a determination unit configured to determine whether the variation amount of the position of each of the chips calculated by the variation amount calculation unit is equal to or less than the condition value inputted by the condition value input unit or not; a measurement point changing unit configured to sequentially change a setting of the measurement points performed by the measurement point setting unit to a different setting; an optimum measurement point determination unit configured to determine a setting of measurement points, in which the variation amount of each of the chips calculated by the variation amount calculation unit is equal to or less than the condition value and a number of the measurement points is minimum, as an optimum measurement point setting, from among the settings of the measurement points sequentially changed by the measurement point changing unit; and an output unit configured to output information related to the optimum measurement point setting determined by the optimum measurement point determination unit.