摘要 |
FIELD: lighting.SUBSTANCE: method of making light-emitting devices comprises steps of providing a lead-frame that includes at least one carrier element, carrier element being conductive, and being partitioned to form a plurality of distinguishable conductive regions, placing at least one LED chip on carrier element, attaching LED chip to each of conductive regions, and separating carrier element from lead frame to provide a LED device with each of conductive regions being electrically isolated from each other, wherein conductive regions are attached to LED chip and are not attached to each other after separation of carrier element from lead frame.EFFECT: invention enables to create cheaper light-emitting products with potentially higher reliability and/or longer service life, as well as cheap method of making light-emitting product.20 cl, 7 dwg |