SUBSTRATE TREATMENT METHOD AND SUBSTRATE TREATMENT DEVICE

摘要

Provided are a substrate treatment method that is capable of properly removing particles adhering to the upper surface of a substrate and a substrate treatment device that executes the method. The following processes are sequentially executed: a paddle formation process S3 for forming a liquid film F of a rinsing solution on the upper surface of a substrate W; a contact process S4 for bringing a member 13 which is provided with a mesh member 134 having multiple gap parts 135 formed therein into contact with the liquid film F; and a particle capturing process S5 for causing side surfaces 134b of the mesh member 134 to capture the particles by creating convection inside the liquid film F of the rinsing solution using interfacial free energy that is generated at three-phase interfaces where the rinsing solution, the atmosphere A, and inner edges of the mesh member 134 of the member 13 intersect with one another.