发明名称 半導体基板の評価方法
摘要 PROBLEM TO BE SOLVED: To provide an evaluation method of a semiconductor substrate capable of measuring the interface state density from a sub-threshold current, while simplifying the evaluation structure manufacturing process.SOLUTION: An evaluation method of a semiconductor substrate by interface state density measurement of the interface between a semiconductor and an insulating film includes a step for forming an insulating film on a first conductivity type semiconductor substrate, a step for removing a part of the insulating film, a step for forming a second conductivity type first diffusion layer, and a second conductivity type second diffusion layer, separated from the first diffusion layer by the insulating film, in a region not covered with the insulating film, a step for forming a second conductivity type channel directly under the insulating film, by placing charges of a predetermined charge surface density on the insulating film by corona charge, a step for measuring the value of a current flowing between the first diffusion layer and second diffusion layer via the channel, and a step for calculating the interface state density based on the relationship of the current value and charge surface density.
申请公布号 JP6020359(B2) 申请公布日期 2016.11.02
申请号 JP20130118669 申请日期 2013.06.05
申请人 信越半導体株式会社 发明人 大槻 剛
分类号 H01L21/66 主分类号 H01L21/66
代理机构 代理人
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