发明名称 |
SPUTTERING TARGET |
摘要 |
Objects of the present invention consist in achievement of both of elongation of life of a sputtering target as well as uniformity of a thickness of a resulting thin coating layer formed on a substrate during the period. The present invention provides a sputtering target comprising a target material, which is characterized in that the target material has a sputtering surface having a first area placed at the center, which is circular and flat; and a second area placed outside of the first area and concentrically with the first area, which has a ring shape, wherein the first area is positioned at a location lower than that of the second area by 15% of thickness of the second area at most, and the first area has a diameter which is ranging from 60% to 80% of a circumferential diameter of the sputtering surface. |
申请公布号 |
US2016343551(A1) |
申请公布日期 |
2016.11.24 |
申请号 |
US201515112242 |
申请日期 |
2015.01.20 |
申请人 |
SUMITOMO CHEMICAL COMPANY, LIMITED |
发明人 |
TAKIGAWA Mikio;KURODA Toshiaki |
分类号 |
H01J37/34;C23C14/34 |
主分类号 |
H01J37/34 |
代理机构 |
|
代理人 |
|
主权项 |
1. A sputtering target comprising a target material, which is characterized in that
the target material has a sputtering surface having
a first area placed at the center, which is circular and flat; anda second area placed outside of the first area and concentrically with the first area, which has a ring shape, wherein the first area is positioned at a location lower than that of the second area by 15% of thickness of the second area at most, and the first area has a diameter which is ranging from 60% to 80% of a circumferential diameter of the sputtering surface. |
地址 |
Tokyo JP |