发明名称 SPUTTERING TARGET
摘要 Objects of the present invention consist in achievement of both of elongation of life of a sputtering target as well as uniformity of a thickness of a resulting thin coating layer formed on a substrate during the period. The present invention provides a sputtering target comprising a target material, which is characterized in that the target material has a sputtering surface having a first area placed at the center, which is circular and flat; and a second area placed outside of the first area and concentrically with the first area, which has a ring shape, wherein the first area is positioned at a location lower than that of the second area by 15% of thickness of the second area at most, and the first area has a diameter which is ranging from 60% to 80% of a circumferential diameter of the sputtering surface.
申请公布号 US2016343551(A1) 申请公布日期 2016.11.24
申请号 US201515112242 申请日期 2015.01.20
申请人 SUMITOMO CHEMICAL COMPANY, LIMITED 发明人 TAKIGAWA Mikio;KURODA Toshiaki
分类号 H01J37/34;C23C14/34 主分类号 H01J37/34
代理机构 代理人
主权项 1. A sputtering target comprising a target material, which is characterized in that the target material has a sputtering surface having a first area placed at the center, which is circular and flat; anda second area placed outside of the first area and concentrically with the first area, which has a ring shape, wherein the first area is positioned at a location lower than that of the second area by 15% of thickness of the second area at most, and the first area has a diameter which is ranging from 60% to 80% of a circumferential diameter of the sputtering surface.
地址 Tokyo JP