| 摘要 |
PROBLEM TO BE SOLVED: To provide a component built-in substrate capable of preventing electrically short-circuiting among neighboring electrode pads.SOLUTION: The component built-in substrate includes: an insulation base material 1; a conductive pad 2 formed on the insulation base material 1; a component 3 connected to the conductive pad 2 being interposed by a solder 4; and a resin 11 covering the component 3. Plural holes 1a are formed in the insulation base material 1 and the conductive pad 2, and the insulation base material 1 is exposed to the side face of hole 1a.SELECTED DRAWING: Figure 8 |
