Method of fabricating an integrated circuit (IC) package having a plurality of spaced apart pad portion

摘要

A process for fabricating an integrated circuit package includes selectively etching a leadframe strip to define a die attach pad and a plurality of contact pads. At least one side of the die attach pad has a plurality of spaced apart pad portions. A semiconductor die is mounted to the die attach pad and wires are bonded from the semiconductor die to respective ones of the contact pads. A first surface of the leadframe strip, including the semiconductor die and wire bonds, is encapsulated in a molding material such that at least one surface of the leadframe strip is exposed. The integrated circuit package is singulated from a remainder of the leadframe strip.

主权项

1. A process for fabricating an integrated circuit package, comprising:
providing a leadframe strip having an upper surface and a lower surface; applying an etch-resist mask to the upper and lower surfaces; patterning the etch-resist mask to expose portions of the upper and lower surfaces; selectively etching both the upper and lower surfaces of the leadframe strip by completely etching through portions of the leadframe strip to define a die attach pad and a plurality of contact pads, and only partially etching through portions of the leadframe strip to form a plurality of spaced apart pad portions on the lower surface; mounting a semiconductor die to said die attach pad; wire bonding said semiconductor die to respective ones of said contact pads; encapsulating the upper surface of said leadframe strip, said semiconductor die, and wire bonds in a molding material, the lower surface of said leadframe strip being exposed; and singulating said integrated circuit package from a remainder of said leadframe strip.