Ruggedized package for electronic components and the like

摘要

A temperature, moisture and shock-resistant package for electronic components includes a polyethylene bag surrounding the components. Wiring leads from the components are polyethylene-shielded and the bag opening is heat-sealed about the wiring. The leads externally of the bag are spliced and soldered to corresponding leads shielded with polyvinylchloride (PVC). The sealed bag is placed between polystyrene boards which are tied together about the bag, the boards and bag being placed in a cylindrical PVC tube. Catalyst-responsive foam fills the remainder of the tube, and PVC end caps are PVC-welded at the ends of the PVC tube. The PVC-shielded leads are run through holes in one of the end caps after being knotted inside the tube. The knots are adhesively secured to the inside surface of the end cap with PVC cement which both prevents the leads from being pulled loose and seals the wiring egress holes in the end cap.