发明名称 INTEGRATED CIRCUIT PACKAGE
摘要 <p>A package for an integrated circuit, especially an ASIC, is of the PQFP type and provided with one or more holes therein to engage studs (3, Fig. 1B) on the circuit hoard (2). The studs and holes are sized and positioned accurately to ensure accurate alignment of pins (5) and tracks (6). Electrical connection is ensured by retaining means, e.g. a nut (4) or solder joint, holding the IC on the stud. In another embodiment, the studs (3) are used to provide power supply or earth connections to the intergrated circuit. <IMAGE></p>
申请公布号 GB9325195(D0) 申请公布日期 1994.02.09
申请号 GB19930025195 申请日期 1993.12.08
申请人 SONY UNITED KINGDOM LIMITED 发明人
分类号 H01L23/31;H01L23/495;H05K3/30;H05K3/32 主分类号 H01L23/31
代理机构 代理人
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