发明名称 Solid state high power amplifier module
摘要 <p>A module for use with a radial combiner comprised of a compartment on one side of a base that contains a plurality of amplifiers located on a printed circuit board having conductive patterns respectively coupling the amplifiers between points along a serial splitter and points along a serial combiner in which operating potential for the amplifiers is derived from storage capacitors connected between two conductors on a separate board via conductive spring fingers having one end attached to one of said conductors and the other end bearing against a conductive pad on the printed circuit board that is coupled to an electrode of an amplifier and in which a plenum is mounted along one edge of the module for conducting cooling air to a duct on the other side of the base. &lt;IMAGE&gt;</p>
申请公布号 EP0746191(A2) 申请公布日期 1996.12.04
申请号 EP19960113906 申请日期 1991.12.23
申请人 STMICROELECTRONICS, INC. 发明人 MARKS, TED M.;MARCHINI, CLAUDIO A.;ALBRECHT, NEVIN A.;MAGGIO, ROBERT F.
分类号 H01P1/30;H01P5/12;H03F3/21;H03F3/60;H03F3/68;(IPC1-7):H05K7/20 主分类号 H01P1/30
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