发明名称 |
Solid state high power amplifier module |
摘要 |
<p>A module for use with a radial combiner comprised of a compartment on one side of a base that contains a plurality of amplifiers located on a printed circuit board having conductive patterns respectively coupling the amplifiers between points along a serial splitter and points along a serial combiner in which operating potential for the amplifiers is derived from storage capacitors connected between two conductors on a separate board via conductive spring fingers having one end attached to one of said conductors and the other end bearing against a conductive pad on the printed circuit board that is coupled to an electrode of an amplifier and in which a plenum is mounted along one edge of the module for conducting cooling air to a duct on the other side of the base. <IMAGE></p> |
申请公布号 |
EP0746191(A2) |
申请公布日期 |
1996.12.04 |
申请号 |
EP19960113906 |
申请日期 |
1991.12.23 |
申请人 |
STMICROELECTRONICS, INC. |
发明人 |
MARKS, TED M.;MARCHINI, CLAUDIO A.;ALBRECHT, NEVIN A.;MAGGIO, ROBERT F. |
分类号 |
H01P1/30;H01P5/12;H03F3/21;H03F3/60;H03F3/68;(IPC1-7):H05K7/20 |
主分类号 |
H01P1/30 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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