| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of manufacturing a semiconductor device which is restrained from increasing in size. SOLUTION: A frame with leads is prepared, the leads of the frame are bent by single pressing so as to rise up, pairs of leads 2 whose tips are made to confront each other respectively are formed at the same time, and a semiconductor chip is placed on the opposed tips of each pair of the leads 2 which are bent and raised up through the intermediary of an adhesive tape. Electrodes of the semiconductor chip and the leads 2 are electrically connected together with electrode wires, the semiconductor chip is sealed up together with the tips of the leads 2 and the electrode wires, and the leads 2 are cut off for each sealed semiconductor chip.</p> |
