Small size sputtering target and high vacuum sputtering apparatus using the same

摘要

A high vacuum sputtering apparatus comprising a vacuum chamber in which a substrate to be processed and a small size sputtering target having an outer diameter less than one and a half times the diameter of the substrate and an area inclined toward the outer periphery thereof on the surface disposed opposite to the substrate are oppositely disposed, and the internal pressure of the vacuum chamber is maintained at less than 1x10-3 Torr for sputtering, thereby obtaining an improved distribution of film thickness and an enhanced coverage symmetry for sputtering./!