| 摘要 |
<p>PROBLEM TO BE SOLVED: To accurately mount a resistant element wire on a printed wiring board by forming the resistant element wire of a conductive wire, a second insulating resin film provided in the periphery of the conductive wire, and a first insulating resin film provided in the most peripheral part. SOLUTION: In a first or second insulating resin film, one or more kinds of heat conductive inorganic particles selected among silica, alumina and beryllia is distributed so as to improve the heat radiating property of a resistant element. The first insulating resin film is formed into a B-stage condition, and the second insulating resin film is formed into a C-stage condition. With this structure, adhesion of the resistant element wire and the printed wiring board are performed by the first insulating resin film, and electrical insulation is performed by the second insulating resin film, and the resistant element wire and the printed wiring board are bonded with each other without hindering the insulating characteristic. A conductor wire is coated with the varnish as a second insulating film, and perfectly hardened, and it is coated with the varnish as a first insulating resin film, and dried for semi-hardening.</p> |
