| 摘要 |
PROBLEM TO BE SOLVED: To provide a heat dissipating device using heat pipes which stably execute heat dissipation despite of fitting postures to electronic parts, and to provide an electronic portable unit. SOLUTION: A heat absorbing part 24 which is closely adhered to CPU (electronic part) 4a and absorbs heat generated in CPU 4a, a plurality heat of pipes 20, 21, 22 and 23 which extend in mutually different directions with the heat absorbing part 24 as a base, are fitted to the heat absorbing part 24 to transfer heat absorbed by the heat absorbing part 24. Heat dissipating parts 26, 27, 28 and 29 which are fitted to the heat pipes 20, 21, 22 and 23, and dissipate heat transferred by the heat pipes 20, 21, 22 and 23, are provided for the heat dissipating device 30. |
