| 摘要 |
PROBLEM TO BE SOLVED: To prevent the occurrence of molding defects, wherein the upper surface of a semiconductor element, wires and the like are exposed by providing a state, wherein a lead is elastically deformed by mounting the lead on a metallic mold and performing closing and the semiconductor element is pushed to the bottom surface of the cavity of a femal mold, and performing resin encapsulation. SOLUTION: A lead frame 4 is provided in a cavity 3. A semiconductor element 5 is connected electrically to the lead frame 4 with a bump 6. At this time, in the lead frame 4, a part which is not in contact with a female mold 2, wherein a a cavity depth (a) of the female mold is made smaller than a summed height (b) of the semiconductor element 5 and the bump 5, is provided. Therefore, when closing is performed, an inner lead 7 causes the elastic deformation due to the difference between the depth (a) and the height (b), and the semiconductor element 5 is pushed to the bottom surface of the female-mold cavity. When the cavity 3 is filled with a resin 8, the inner lead 7 is encapsulated with resin under elastically deformed state. Thus, molding defects such as the exposure of the upper part of the semiconductor element, the cracking of the semiconductor element and the like can be prevented. |
